| The detection of toxic and hazarous substance in electonic and information products and their components such as decorative packaging materials |
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Heavy metals such as cadmium compounds Cd ,lead and lead compouds Pb ,mercury and mercury compounds Hg , hexavalent chromium compouds Cr6+. Organic Bromine Compounds (flame retardants) Such as PBBs, PBBs enter PBDEs such as organic bromine compounds 3 Analysis of ingorganic elements 4 Bisphenol A , perfluorooctane sulfonate (PFOS) , phthalate Acid ester , polycyclic aromatic hydrocarbons (PAHs) , Nonglphenol, halogen, Azo compounds , formaldehyde, PVC and mixture of PVC, silicon and its alloys , orangic phosphorus compounds , antimony Oxide and its mixture, phthalates, chlorohydiocarbon,etc. |
| Determination of parameters of metal , alloy minteral products and their components or materials. |
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1 Metals , alloys and their components Such as chemical components qualitative and quantitative alalysis, structural analysis (NDT,coating testing , the equivalent); mechanical properties testing , failure analysis , surface analysis . 2 Mineral composition analysis and phase analysis 3 Alloy powder analysis |
| Determimation of parameters of polymers and their components or materials |
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1 Qualitative material Such as rubber , plastics , adhesives paint ink , etc. 2 Mechanical properties 3 Thermal properties 4 Properties 5 Coating performance 6 Combustion performance |
| Quality certification or determination of parameters of qualitative composition of electronic materials and quautitative analysis. |
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The detemination of all types of material’s material qualitative and quantitative analysis of micro-analysis , structural analysis , performance tests , physical parameters , technical parameters. 1 Semiconductor material Such as silicon,gallium , arsenide,gallium phosphide , indium phosphide and indium antimony , alaminum gallium arsenic , silicon carbide , etc. 2 Lesd material Such as tin plated copper , tin plated copper alloy of lead , lead-free plating copper , clad steel, key alloy coire and si-wire ,etc. 3 Electronic welding macterials Such as tin- lead solders,lead-free solder dolder wire lead-free welding wire , paste, flux , etc. 4 Other materials Such as electronic alumicon foil , copper foil electronic inftrared materials , electric vacuum materials , optical materials, packaging materials , electronic materials such as pulp and frameworks , etc. |
| Reliability test of electronic and information products and its annex |
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1 Electronic components quality inspction such as analysis of coating ,welding and testing , testing heat-resistant, moisture-sensitive tests , tin to be tested, electronic components and components of environment experiment in temperature impact , hot and humid , drops , vibration, salt spray , etc. 2 Failure analysis such as electronic components failure analysis , integrated circuit failure analysis, circuit board assembly of solder joint quality defects and failure analysis. 3 Lead-free solder reliability test about biopsy test , kim sang, solder joints tensile strength. |
| Aging-test of products or man-made enviroment |
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1 electronic components quality inspection such as analysis of coating ,welding and testing , testing heat-resistant, moisture-sensitive tests , tin to be tested, electronic components and components of environment experiment in temperature impact , hot and humid , drops , vibration, salt spray , etc. 2 Failure analysis such as electronic components failure analysis , integrated circuit failure analysis, circuit board assembly of solder joint quality defects and failure analysis. 3 Lead-free solder reliability test about biopsy test , kim sang, solder joints tensile strength. |
| Non-ODS cleaning agent detection and claening technology test |
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1 The quality of detection about non-ODS cleaning agent . 2 Cleaning agents and cleaning process screening test . 3 Circuit board assemblies , LCD, precision metal parts , ceramic parts, electronic components and optical lenses cleaning. |













