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   Scanning electron microscope

 

  Characteristics: The field emission scanning electron microscope can have greater resolution and magnification times than an optical microscope. The resolution of secondary electron image is 1.4nm and the magnification times can be continuously altered. It can relieve carrying capacity in low vacuum mode and can observe electrically non-conductive specimens without spraying metal coatings. Samples as large as 180mm in diameter can be handled routinely, without being damaged by the SEM. Energy Dispersive Spectroscopy of X=ray (EDX) as accessory is used to identify the chemical composition by quantitative and quality analysis, line scanning, surface scanning, and components image.

 

 

Applications: The morphology and composition analysis of metal materials, building materials, ceramic materials, electronic materials, nano-materials, powder samples, biological samples, fiber, plastics, rubber, and other samples. It can also used to perform failure analysis of integrated circuits electronic components and metal devices.

 

  Electric universal testing machine

 

 Applications: The tensile, compression, bending, and other mechanical test of metal, ceramic, plastic, rubber, fiber and other materials

 

 

  Characteristics: A wide range of measurement – load between 1N to 300 kN.
Displacement rate: 0.001 ~ 500 mm / min.
High accuracy of measurement- load accuracy: ± 1% of indicating value. Displacement accuracy: ± 0.5% of indicating value. Displacement rate accuracy: 0.2% of indicating value. Control accuracy: ± 1% of indicating value.
Multi-control mode – control of force, control of displacement, control of deformation, control of stress, control of strain.
Experiment process control, data acquisition and results calculation can be done by computer.

 

   Leitz metallographic microscope

 

 

Features and Applications: Magnification up to 1,000 times and more details can be seen.  Differential interference functions (100 times). Samples are placed in the inverted way, so that it will be more convenient, smooth and easy to focus on,
Two observation manners- Directly observe by eyepiece and observe by computer.

Two image output way - traditional film and digital photos.
It can be used for metallographic analysis and defect inspection of metal and semiconductor

 

 

 Surface Profiler

Performance parameters:horizontal resolution: 0.01 μ m
vertical resolution: 1Å

 

 性能参数：
1. 全元素分析（H—U）
2. 同位素分析（所有元素）
3. 高灵敏度（优于1ppm，多数元素可达1ppb
4. 深度剖析（深度分辨率可达2nm）
5. 二次离子图像分析（分辨率优于1μm

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